Intel Incorporated
Content
INTEL CORPORATION.
1. COMPANY PROFILE: Intel Corporation, incorporated in 1968, designs and manufactures integrated digital technology platforms. A platform consists of a microprocessor and chipset. The Company sells these platforms primarily to original equipment manufacturers (OEMs), original design manufacturers (ODMs), and industrial and communications equipment manufacturers in the computing and communications industries. The Company’s platforms are used in a range of applications, such as personal computers (PCs) (including Ultrabook systems), data centers, tablets, smartphones, automobiles, automated factory systems and medical devices. The Company also develops and sells software and services primarily focused on security and technology integration. The Company offers platforms that incorporate various components and technologies, including a microprocessor and chipset. A microprocessor-the central processing unit (CPU) of a computer system-processes system data and controls other devices in the system. It offers microprocessors with one or multiple processor cores. Its second and third generation Intel Core processor families integrate graphics functionality onto the processor die. In contrast, some of its previous-generation processors incorporated a separate graphics chip inside the processor package.
The Company also offers graphics functionality as part of a separate chipset outside the processor package. Processor packages may also integrate the memory controller. A chipset sends data between the microprocessor and input, display, and storage devices, such as the keyboard, mouse, monitor, hard drive or solid-state drive, and compact disc (CD), digital versatile disc (DVD) or Blu-ray drive. The Company offers and develops System-on-Chip (SoC) products that integrate its core processing functions with other system components, such as graphics, audio, and video, onto a single chip. The Company offers Intel vPro technology, a computer hardware-based security technology for the notebook and desktop market segments. During 2011, it introduced the second generation Intel Core vPro processor family. The Company offers components and platforms for mobile phones and connected devices. Key mobile phone components include baseband processors, radio frequency transceivers and power management integrated circuits. It also offers mobile phone platforms, including Bluetooth wireless technology and global positioning system (GPS) receivers, software solutions, customization, and essential interoperability tests. The Company competes with Taiwan Semiconductor Manufacturing Company, Ltd., GlobalFoundries Inc., Advanced Micro Devices, Inc., International Business Machines Corporation, Oracle Corporation, ARM Limited, NVIDIA Corporation, MIPS Technologies, Inc., QUALCOMM Incorporated, Texas Instruments Incorporated and Symantec Corporation.
2. Statistics.
Most Recent Fiscal Year Results Revenue $ 53.34B Research and Development 10.15B Expense $ EPS $ 2.13 Dividend Per Share $ 0.87 5-Year Financial Results 5-Year Revenue Growth 8.75 Rate % EPS (5 year GAAP ratio of 19.98 EPS growth) % Dividend % 12.07 Dividends 5-Year Average Dividend 0.68 Dividend Yield % 3.80 Dividends Per Share $ 0.87 Dividend Change % 10.07 Financial Strength Quick Ratio 1.60 Current Ratio 2.30 LT Debt/Equity 24.00 Total Debt/Equity 24.00
Price & Volume Recent Price $ 23.88 52 Week High $ 25.98 52 Week Low $ 19.23 Average Vol 34.43M Valuation Ratios Price/Earnings 12.90 Price/Sales 2.27 Price/Book 2.21 Per Share Ratios Dividends Per Share 0.87 $ Book Value $ 11.13 EPS $ 2.13 Revenue/Share $ 10.51 Share Related Items Market Cap. (Mil) $ 118,945.25 Shares Out (Mil) 4,982.00 Efficiency Asset Turnover 0.70 Inventory Turnover 2.90 Return on Assets 11.10
MARKET SHARE OF INTEL IN MOBILE CPU FOR 2013.
The 100 largest companies in the world by market value in 2013 in million U.S. dollars Intel has a market value of 107,995.80 million U.S Dollars.
3. MARKET STATUS OF INTEL.
4. EXPERTISE OF COMPANY Intel was an early developer of SRAM and DRAM memory chips, and this represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in
1971, it was not until the success of the personal computer (PC) that this became its primary business. During the 1990s, Intel invested heavily in new microprocessor designs fostering the rapid growth of the computer industry. During this period Intel became the dominant supplier of microprocessors for PCs, and was known for aggressive and sometimes illegal tactics in defense of its market position, particularly against Advanced Micro Devices (AMD), as well as a struggle with Microsoft for control over the direction of the PC industry. 5. DESCRIPTION OF EVENTS AND PRODUCTS Intel was originally founded in Mountain View, California in 1968 by Gordon E. Moore (of "Moore's Law" fame, a chemist and physicist), Robert Noyce (a physicist and co-inventor of the integrated circuit), Arthur Rock (investor and venture capitalist), and Max Palevsky. Moore and Noyce came from Fairchild Semiconductor and were Intel's first two employees. Rock was not an employee, but he was an investor and Chairman of the Board. The total initial investment in Intel was $2.5 million convertible debentures and $10,000 from Rock. Just 2 years later, Intel completed their initial public offering (IPO), raising $6.8 million ($23.50 per share). Intel's third employee was Andy Grove,a chemical engineer, who later ran the company through much of the 1980s and the high-growth 1990s. Moore and Noyce initially wanted to name the company "Moore Noyce". The name, however, was a partial homophone for "more noise" – an ill-suited name for an electronics company, since noise in electronics is usually very undesirable and typically associated with bad interference. Instead they used the name NM Electronics for almost a year, before deciding to call their company Integrated Electronics or "Intel" for short. Since "Intel" was already trademarked by the hotel chain Intelco, they had to buy the rights for the name. EVENTS CHANGING THE COURSE OF INTEL INC. A. CEO’S (Intel has just 6 CEO’s till its inception to 2013). 1. Robert N. Noyce CEO: 1968-1975 CAREER: Noyce first worked at Shockley Semiconductor, but he and seven others left Shockley to start Fairchild Semiconductor in 1957, the first successful semiconductor company in the region. There Noyce invented a process for making integrated circuits. In 1968 Noyce and colleague Gordon Moore formed Intel. He was the president and chief executive from 1968 until 1975. At the time of his death Noyce was president of Sematech. EDUCATION: Ph.D in physics, Massachusetts Institute of Technology, 1953; Bachelor's degree in mathematics, Grinnell College, 1949. AGE: 1927-1990 (died at age 62). 2. Gordon E. Moore
CEO, 1975-1987 CAREER: Moore joined Shockley Semiconductor Laboratory in 1956, working on semiconductor process technology with William Shockley, co-inventor of the transistor. He was a co-founder of Fairchild Semiconductor, which produced the world's first commercial integrated circuit. In 1968, with the late Dr. Robert Noyce, he cofounded Intel. He was chief executive from 1979 until 1987, and was chairman of the board from 1979 until 1997. EDUCATION: Ph.D in chemistry and physics, California Institute of Technology., 1954; B.S. in chemistry, University of California-Berkeley, 1950. AGE: Born January 3, 1929 3. Andrew S. Grove CEO, 1987-1998 CAREER: Grove originally worked at Fairchild Semiconductor and joined Intel in 1968, creating the company's chip manufacturing operation. He was named chief operating officer in 1976 and president in 1979. He became chief executive in 1987 and was chairman of the board from 1997 to 2005. EDUCATION: Ph.D., University of California-Berkeley, 1963; B.A. in chemical engineering, City College of New York, 1960. AGE: Born September 2, 1936 4. Craig R. Barrett CEO, 1998-2005 CAREER: Joined Intel in 1974 and is credited with perfecting the manufacturing process for Intel's powerful microprocessors. He served as chief operating officer from 1993 to 1997, president from 1997 to 1998; chief executive from 1998 through 2005; and chairman from 2005 until 2009. EDUCATION: Ph.D. in materials science, Stanford University, 1964 AGE: Born August 29, 1939 5. Paul S. Otellini CEO, 2005-2013 CAREER: Otellini spent his career at Intel, joining the finance department in 1974 and holding a variety of management positions including chief operating officer and manager of several divisions. Otellini served as Intel's president and chief operating officer from 2002 to 2005 and was also elected to Intel's board of directors in 2002. He became CEO in May 2005.
EDUCATION: MBA, University of California-Berkeley, 1974; B.A. in economics, University of San Francisco, 1972 AGE: Born Oct. 12, 1950 6. Brian M. Krzanich CEO: Will become the chief executive officer on May 16. CAREER: Has been chief operating officer of Intel since January 2012. He previously held senior leadership positions in manufacturing with the company and began his career at Intel in 1982 as a process engineer. EDUCATION: B.A. in chemistry, San Jose State University, 1982 AGE: 52 B. PRODUCTS. At its founding, Intel was distinguished by its ability to make semiconductors. Its first product, in 1969, was the 3101 Schottky TTL bipolar 64-bit static random-access memory (SRAM), which was nearly twice as fast as earlier Schottky diode implementations by Fairchild and the Electrotechnical Laboratory in Tsukuba, Japan.In the same year Intel also produced the 3301 Schottky bipolar 1024-bit read-only memory (ROM) and the first commercial metal–oxide– semiconductor field-effect transistor (MOSFET) silicon gate SRAM chip, the 256-bit 1101. Intel's business grew during the 1970s as it expanded and improved its manufacturing processes and produced a wider range of products, still dominated by various memory devices. While Intel created the first commercially available microprocessor (Intel 4004) in 1971 and one of the first microcomputers in 1972, by the early 1980s its business was dominated by dynamic random-access memory chips. However, increased competition from Japanese semiconductor manufacturers had, by 1983, dramatically reduced the profitability of this market, and the sudden success of the IBM personal computer convinced then-CEO Andrew Grove to shift the company's focus to microprocessors, and to change fundamental aspects of that business model. By the end of the 1980s this decision had proven successful. Buoyed by its fortuitous position as microprocessor supplier to IBM and IBM's competitors within the rapidly growing personal computer market, Intel embarked on a 10-year period of unprecedented growth as the primary (and most profitable) hardware supplier to the PC industry. By launching its Intel Inside marketing campaign in 1989, Intel was able to associate brand loyalty with consumer selection, so that by the end of the 1990s, its line of Pentium processors had become a household name. TIMELINE:
6. ORGANIZATION STRUCTURE
7.
UPGRADATION STRATEGY
Sand 1. With about 25% (mass) Silicon is –after Oxygen –the second most frequent chemical element in the earth’s crust. 2. Sand –especially Quartz -has high percentages of Silicon in the form of Silicon dioxide (SiO2) and is the base ingredient for semiconductor manufacturing. Melted Silicon – Scale: wafer level (~300mm/ 12 inch) 1. Silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called Electronic Grade Silicon. 2. Electronic Grade Silicon may only have one alien atom every one billion Silicon atoms. The resulting mono crystal is called Ingot. Mono-crystal Silicon Ingot – Scale: wafer level (~300mm/ 12 inch) 1. An ingot has been produced from Electronic Grade Silicon. 2. One ingot weights about 100 kilograms (=220 pounds) and has a Silicon purity of 99.9999%.
Ingot Slicing – Scale: wafer level (~300mm / 12 inch) 1. The Ingot is cut into individual silicon discs called wafers.
Wafer– Scale: wafer level (~300mm/ 12 inch)
1. The wafers are polished until they have flawless, mirror-smooth surfaces. 2. Intel buys those manufacturing ready wafers from third party companies. 3. Intel’s highly advanced 45nm High-K/Metal Gate process uses wafers with a diameter of 300 millimeter (~12 inches). 4. When Intel first began making chips, the company printed circuits on 2-inch (50mm) wafers. Now the company uses 300mm wafers, resulting in decreased costs per chip.
Applying Photo Resist – Scale: wafer level (~300mm / 12 inch) 1. The liquid (blue here) that’s poured onto the wafer while it spins is a photo resist finish similar as the one known from film photography. 2. The wafer spins during this step to allow very thin and even application of this photo resist layer. Exposure– Scale: wafer level (~300mm / 12 inch) 1. The photo resist finish is exposed to ultra violet (UV) light. The chemical reaction triggered by that process step is similar to what happens to film material in a film camera the moment you press the shutter button. The photo resist finish that’s exposed to UV light will become soluble. The exposure is done using masks that act like stencils in this process step. When used with UV light, masks create the various circuit patterns on each layer of the microprocessor. A lens (middle) reduces the mask’s image. 2. So what gets printed on the wafer is typically four times smaller linearly than the mask’s pattern. Exposure– Scale: transistor level (~50-200nm) 1. Although usually hundreds of microprocessors are built on a single wafer, this picture story will only focus on a small piece of a microprocessor from now on –on a transistor or parts thereof. 2. A transistor acts as a switch, controlling the flow of electrical current in a computer chip. Intel researchers have developed transistors so small that about 30 million of them could fit on the head of a pin.
Washing off of Photo Resist – Scale: transistor level (~50-200nm) 1. The gooey photo resist is completely dissolved by a solvent. 2. This reveals a pattern of photo resist made by the mask. Etching– Scale: transistor level (~50-200nm) 1. The photo resist is protecting material that should not be etched away. 2. Revealed material will be etched away with chemicals. Removing Photo Resist – Scale: transistor level (~50-200nm) 1. After the etching the photo resist is removed and the desired shape becomes visible.
Applying Photo Resist – Scale: transistor level (~50-200nm) 1. There’s photo resist (blue color) applied, exposed and exposed photo resist is being washed off before the next step. 2. The photo resist will protect material that should not get ions implanted. Ion Implantation – Scale: transistor level (~50-200nm) 1. Through a process called ion implantation (one form of a process called doping), the exposed areas of the silicon wafer are bombarded with various chemical impurities called Ions. 2. Ions are implanted in the silicon wafer to alter the way silicon in these areas conducts electricity. 3. Ions are shot onto the surface of the wafer at very high speed. An electrical field accelerates the ions to a speed of over 300,000 km/h (~185,000 mph) Removing Photo Resist – Scale: transistor level (~50-200nm) 1. After the ion implantation the photo resist will be removed and the material that should have been doped (green) has alien atoms implanted now (notice slight variations in color).
Ready Transistor – Scale: transistor level (~50-200nm) 1. This transistor is close to being finished. 2. Three holes have been etched into the insulation layer (magenta color) above the transistor. 3. These three holes will be filled with copper which will make up the connections to other transistors. Electroplating– Scale: transistor level (~50-200nm) 1. The wafers are put into a copper sulphate solution as this stage. 2. The copper ions are deposited onto the transistor thru a process called electroplating. 3. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode) which is represented by the wafer. After Electroplating – Scale: transistor level (~50-200nm) 1. On the wafer surface the copper ions settle as a thin layer of copper. The Tick-Tock Model Through the Years Intel’s ―tick-tock‖ model inspires confidence in the future of microprocessors and the devices that depend on them. Following this model, Intel commits to—and has successfully delivered—continued innovations in manufacturing process technology and processor microarchitecture in alternating ―tick‖ and ―tock‖ cycles. Architectures releases until now: 1. P6,Netburst(Tock). 2. Core(Tock). 3. Penryn(Tick). 4. Nehalem(Tock). 5. Westmere(Tick). 6. Sandy bridge(Tock). 7. IvyBridge(Tick). 8. Haswell(Tock). 9. Broadwell(Tick). 10. Skylake(Tock). 11. CannonLake(Tick). 12. Larrabee(Tock). 13. Bonnell(Tock). 14. Saltwell(Tick).
15. Silvermont(Tock). 16. Airmont(Tock).
8. MANAGEMENT STRATEGY The number and variety of devices connected to the Internet are growing, and computing is becoming an increasingly personal experience. End users value consistency across devices that connect seamlessly and effortlessly to the Internet and to each other. Intel helps to enable this experience by innovating around three pillars of computing: energy-efficient performance, connectivity, and security. To meet these objectives, we are using our core assets: our silicon and process technology, our architecture and platforms, our global presence, our strong rela tionships across the industry, and our brand recognition. 1. Grow the PC and data center business with new users and uses. 2. Extend Intel’s PC platform leadership and develop exciting innovations to deliver new user experiences; and lead the transformation to open data centers and cloud computing. 3. Extend Intel solutions into adjacent markets. Transform the embedded industry with Intel® architecture (IA) in new market segments; and launch and ramp IA solutions in smartphones, tablets, smart TVs, and vehicles. 4. Create a continuum of personal computing. Expand IA differentiation with new capabilities across devices; excite leading software developers to create the best user experiences and applications on IA; and deliver new usage models with multi-communications connectivity. 5. Intel as an organization is extremely aware that the demand for its own main product, the microprocessor, is crucially dependent upon the continuous supply of complementary products by other firms. 6. Intel’s philosophy is that achieving platform leadership requires that a firm continuously innovate through internal processes on its own core product and successfully encourage complementors not only to supply but to keep innovating on complementary products. 7. The analysis of the data suggests that the strategic goal of Intel is to obtain consensus in the industry while maintaining some degree of directional control over interfaces,
affecting a large number of third-parties’ design decisions. 8. Intel is able to maintain an increasing supply of quality complementary products, even as the Intel microprocessor evolves, by a careful balancing act of competition and cooperation with third-parties. 9. In an industrial setting where the definition of roles is ambiguous, there is plenty of room for strategic choices. For example, intellectual property choices in interface design (e.g., deciding whether the product’s interface specification is ―proprietary‖ or ―open‖ to thirdparties) radically affects the incentives and costs for potential complementors to innovate on complementary products, and can induce either more competition — or a greater supply of complements. 10. Intel makes several kinds of interrelated decisions to achieve platform leadership: design decisions (where to put the interface — i.e., the boundary of the product); intellectual property decisions (whether the specification of this interface will be open or closed); pricing decisions (how much Intel will charge for royalties, if any, on ―half-products‖ such as APIs or SDKs); and mode of behavior decisions (i.e., acting towards another firm as a competitor or a complementor). 11. Intel has also set in place specific processes by which it initiates the design of interface standards and then rallies the consensus of other firms. 12. Intel often invests heavily up front in designing internal interfaces on which, later, it frequently chooses not to make any profit. Relinquishing royalty rights on the specifications and carefully integrating the technical input early and gradually in the process facilitates the endorsement of key players. 13. Intel also maintains loyalty from third-parties by signaling the low likelihood of Intel’s behaving against them opportunistically in the short term. Where complementors have a choice, Intel aims to nurture their incentives to innovate on products that are complementary to Intel, and not rival, products. Intel seems to enjoy high returns for building and sustaining its reputation as a firm that does not impulsively or carelessly step out of its product boundaries into the territory of its complementors. The informal, longterm relationships that are developed between Intel and third-parties provide a setting that fosters innovation and protects both from each other’s opportunism. 9. UPCOMING PROJECTS a. Broadwell Architecture: Broadwell is Intel's codename for the second processor in its Haswell microarchitecture. In keeping with Intel's tick-tock principle, Broadwell is the next step in semiconductor fabrication, with feature size reduced to 14 nanometers. Broadwell will adopt the Multi-Chip Package (MCP) design. New layout might be also moving the integrated voltage regulator (iVR) off-die and back onto the motherboards, in an attempt to reduce CPU's heat production. b. Skylake Architecture: Skylake is the codename for a processor micro architecture to be developed by Intel as the successor to the Hasswell architecture.Skylake will use a 14 nm process. There are no official details regarding this microarchitecture's development. The first Skylake processors are expected in 2015-2016.
10. INTEL’S RELATION TO MATERIAL REQUIREMENT PLANNING Material Replenishment Method. 1. This MRP driven procurement method is used with select direct materials suppliers across Intel's Systems Manufacturing and Assembly/Test sites. 2. This forecast is communicated with suppliers via RosettaNet XML PIP 4A3 and/or the Web Forecast application's Delivery Schedule Report. 3. Suppliers are required to ship a specific quantity of a material to an Intel site by a specified date. Material Requirements Planning. 1. MRP is a set of techniques using inventory position, bill of material (BOM) information, and the master production schedule (MPS) to calculate time-phased material requirements. 2. MRP data is pulled into the ARM replenishment system, enabling ARM to create replenishment forecasts for Suppliers. Partner Interface Process. 1. The RosettaNet model that depicts the activities, decisions and Partner Role interactions that fulfill an eBusiness transaction between two partners in a supply chain. 2. Each Partner must fulfill all obligations specified in a PIP. 3. If any one party fails to perform a service as specified in the approved RosettaNet PIP documentation then the business transaction is null and void. Web Forecast. 1. This is a component of the Web Suite application. 2. It includes forecast information from Outsourcing Enterprise Solutions Systems Manufacturing (OeS SM), Edge to Edge Capacity Exchange Planning (e2e CapX), and Materials Auto Replenishment (MAR). INTEL BUSINESS CONTINUITY PRINCIPLES: Intel’s business continuity program is based upon five key principles:Assess, Prepare, Test, Improve, and Communicate. 1.Assess:Accomplished through a Risk and Impact Assessment process.Every Designated organization is required to annually review and update their Risk and Impact Assessments for core business functions. 2. Prepare: A process of creating a business continuity plan based on the findings from the Risk and Impact Assessment 3. Test: Exercising the business continuity plan through realistic drill scenarios. 4. Improve: The process of strengthening our plans based upon discoveries made During tests or real life events.
11. MARKET EVALUATIONS
12. AWARDS AND RECOGNITIONS: 1. Intel is ranked 68 on FORTUNE Magazine's 100 Best Companies to Work for List! 2. Most InDemand Employers among Software Engineers (LinkedIn*) 3. World’s Greenest Companies list (Newsweek*) 4. Greenest Companies in America list -Top ten! (Newsweek) 5. Top 100 Veteran-Friendly Companies (U.S. Veterans Magazine*) 6. World’s Most Attractive Employers 2013 (Universum) 7. Top 50 Employer - #5! (Workforce Diversity) 8. National Top 50 list (US EPA) 9. India’s Best Places to Work For - Intel India #2 10. World’s Most Ethical Companies 2013 11. Best Place to Work - Intel Israel ranked 2nd!
12. WORKING CONDITIONS
Income for a Software Engineer at Intel (Mid Thirties)
How Much House Can I Afford?
Annual Household Income Monthly Gross Income Monthly State Income Tax (4%) Monthly Federal Income Tax (25%) Monthly minimum debt Monthly car payment Monthly student loan payment Minimum monthly credit card debt payment Total monthly salary left after debt and taxes Down Payment Amount Maximum I can pay for PITI a month (34% of your gross monthly income) Monthly Property Taxes Homeowner's insurance premium Maximum Principal and Interest Payment Maximum Loan Amount Maximum Purchase Price I can afford $66,000.00 $5,500.00 $220.00 $1,375.00 $550.00 $400.00 $0.00 $150.00 $3,355.00 $250,000.00 $1,870.00 $407.29 $69.64 $1,393.07 $238,750.00 $488,750.00
% of monthly gross
% of monthly gross after taxes and debt
4.00% 25.00% 10.00% 7.27% 0.00% 2.73% 61.00%
34.00% 7.41% 1.27% 25.33%
55.74% 12.14% 2.08% 41.52%
Cash left each month after taxes, debt, and PITI paid
$1,485.00
27.00%
REFERENCES: 1. http://www.intel.in/content/www/in/en/company-overview/company-overview.html 2. http://www.intel.in/content/www/xa/en/corporate-responsibility/corporate-responsibility.html 3. http://www.intel.com/content/www/us/en/jobs/locations/india.html 4. http://www.intel.in/content/www/in/en/intel-innovation/innovations.html 5. http://beforeyoubuypc.intel.in/learn 6. http://www.theinquirer.net/inquirer/news/1031210/secret-intel-revealed 7. http://news.cnet.com/2009-1001-215854.html 8. http://news.bbc.co.uk/2/hi/special_report/1998/04/98/INTEL/215645.stm 9. http://www.google.com/hostednews/afp/article/ALeqM5iSCa-6QNqHQ7MfRAjCk2vPtCvzOQ 10. http://edition.cnn.com/2011/TECH/mobile/05/04/intel.event/index.html 11. http://semiaccurate.com/2011/08/18/intel-moves-transistors-from-2d-to-3d-and-more/ 12. http://www.statista.com/statistics/263264/top-companies-in-the-world-by-market-value/ 13. http://www.intel.in/content/www/in/en/company-overview/intelmuseum.html?wapkw=intel+museum 14. http://www.intel.in/content/www/in/en/corporate-responsibility/corporate-responsibility-2007report.html 15. http://www.nytimes.com/2013/04/17/technology/intel-profits-fall-as-pc-slump-cuts-demand-forchips.html?_r=1 16. http://www.undeadly.org/cgi?action=article&sid=20060930232710&mode=expanded 17. http://media.corporateIr.net/media_files/irol/10/101302/2007annualReport/common/pdfs/intel_2007ar.pdf 18. http://www.google.com/finance?q=NASDAQ%3AINTC&fstype=ii&ei=bNL4ULj_B4rCkgXZe A 19. http://www.appliancedesign.com/eid/INTEL 20. http://news.cnet.com/8301-13924_3-20075602-64/intel-maps-out-tablet-plans-through2014/?part=rss&subj=news&tag=2547-1_3-0-20 21. In.reuters.com/intel 22. en.wikipedia.org wiki List of Intel microprocessors 23. http://www.intc.com/pricelist.cfm 24. http://www.intc.com/financials.cfm
1. COMPANY PROFILE: Intel Corporation, incorporated in 1968, designs and manufactures integrated digital technology platforms. A platform consists of a microprocessor and chipset. The Company sells these platforms primarily to original equipment manufacturers (OEMs), original design manufacturers (ODMs), and industrial and communications equipment manufacturers in the computing and communications industries. The Company’s platforms are used in a range of applications, such as personal computers (PCs) (including Ultrabook systems), data centers, tablets, smartphones, automobiles, automated factory systems and medical devices. The Company also develops and sells software and services primarily focused on security and technology integration. The Company offers platforms that incorporate various components and technologies, including a microprocessor and chipset. A microprocessor-the central processing unit (CPU) of a computer system-processes system data and controls other devices in the system. It offers microprocessors with one or multiple processor cores. Its second and third generation Intel Core processor families integrate graphics functionality onto the processor die. In contrast, some of its previous-generation processors incorporated a separate graphics chip inside the processor package.
The Company also offers graphics functionality as part of a separate chipset outside the processor package. Processor packages may also integrate the memory controller. A chipset sends data between the microprocessor and input, display, and storage devices, such as the keyboard, mouse, monitor, hard drive or solid-state drive, and compact disc (CD), digital versatile disc (DVD) or Blu-ray drive. The Company offers and develops System-on-Chip (SoC) products that integrate its core processing functions with other system components, such as graphics, audio, and video, onto a single chip. The Company offers Intel vPro technology, a computer hardware-based security technology for the notebook and desktop market segments. During 2011, it introduced the second generation Intel Core vPro processor family. The Company offers components and platforms for mobile phones and connected devices. Key mobile phone components include baseband processors, radio frequency transceivers and power management integrated circuits. It also offers mobile phone platforms, including Bluetooth wireless technology and global positioning system (GPS) receivers, software solutions, customization, and essential interoperability tests. The Company competes with Taiwan Semiconductor Manufacturing Company, Ltd., GlobalFoundries Inc., Advanced Micro Devices, Inc., International Business Machines Corporation, Oracle Corporation, ARM Limited, NVIDIA Corporation, MIPS Technologies, Inc., QUALCOMM Incorporated, Texas Instruments Incorporated and Symantec Corporation.
2. Statistics.
Most Recent Fiscal Year Results Revenue $ 53.34B Research and Development 10.15B Expense $ EPS $ 2.13 Dividend Per Share $ 0.87 5-Year Financial Results 5-Year Revenue Growth 8.75 Rate % EPS (5 year GAAP ratio of 19.98 EPS growth) % Dividend % 12.07 Dividends 5-Year Average Dividend 0.68 Dividend Yield % 3.80 Dividends Per Share $ 0.87 Dividend Change % 10.07 Financial Strength Quick Ratio 1.60 Current Ratio 2.30 LT Debt/Equity 24.00 Total Debt/Equity 24.00
Price & Volume Recent Price $ 23.88 52 Week High $ 25.98 52 Week Low $ 19.23 Average Vol 34.43M Valuation Ratios Price/Earnings 12.90 Price/Sales 2.27 Price/Book 2.21 Per Share Ratios Dividends Per Share 0.87 $ Book Value $ 11.13 EPS $ 2.13 Revenue/Share $ 10.51 Share Related Items Market Cap. (Mil) $ 118,945.25 Shares Out (Mil) 4,982.00 Efficiency Asset Turnover 0.70 Inventory Turnover 2.90 Return on Assets 11.10
MARKET SHARE OF INTEL IN MOBILE CPU FOR 2013.
The 100 largest companies in the world by market value in 2013 in million U.S. dollars Intel has a market value of 107,995.80 million U.S Dollars.
3. MARKET STATUS OF INTEL.
4. EXPERTISE OF COMPANY Intel was an early developer of SRAM and DRAM memory chips, and this represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in
1971, it was not until the success of the personal computer (PC) that this became its primary business. During the 1990s, Intel invested heavily in new microprocessor designs fostering the rapid growth of the computer industry. During this period Intel became the dominant supplier of microprocessors for PCs, and was known for aggressive and sometimes illegal tactics in defense of its market position, particularly against Advanced Micro Devices (AMD), as well as a struggle with Microsoft for control over the direction of the PC industry. 5. DESCRIPTION OF EVENTS AND PRODUCTS Intel was originally founded in Mountain View, California in 1968 by Gordon E. Moore (of "Moore's Law" fame, a chemist and physicist), Robert Noyce (a physicist and co-inventor of the integrated circuit), Arthur Rock (investor and venture capitalist), and Max Palevsky. Moore and Noyce came from Fairchild Semiconductor and were Intel's first two employees. Rock was not an employee, but he was an investor and Chairman of the Board. The total initial investment in Intel was $2.5 million convertible debentures and $10,000 from Rock. Just 2 years later, Intel completed their initial public offering (IPO), raising $6.8 million ($23.50 per share). Intel's third employee was Andy Grove,a chemical engineer, who later ran the company through much of the 1980s and the high-growth 1990s. Moore and Noyce initially wanted to name the company "Moore Noyce". The name, however, was a partial homophone for "more noise" – an ill-suited name for an electronics company, since noise in electronics is usually very undesirable and typically associated with bad interference. Instead they used the name NM Electronics for almost a year, before deciding to call their company Integrated Electronics or "Intel" for short. Since "Intel" was already trademarked by the hotel chain Intelco, they had to buy the rights for the name. EVENTS CHANGING THE COURSE OF INTEL INC. A. CEO’S (Intel has just 6 CEO’s till its inception to 2013). 1. Robert N. Noyce CEO: 1968-1975 CAREER: Noyce first worked at Shockley Semiconductor, but he and seven others left Shockley to start Fairchild Semiconductor in 1957, the first successful semiconductor company in the region. There Noyce invented a process for making integrated circuits. In 1968 Noyce and colleague Gordon Moore formed Intel. He was the president and chief executive from 1968 until 1975. At the time of his death Noyce was president of Sematech. EDUCATION: Ph.D in physics, Massachusetts Institute of Technology, 1953; Bachelor's degree in mathematics, Grinnell College, 1949. AGE: 1927-1990 (died at age 62). 2. Gordon E. Moore
CEO, 1975-1987 CAREER: Moore joined Shockley Semiconductor Laboratory in 1956, working on semiconductor process technology with William Shockley, co-inventor of the transistor. He was a co-founder of Fairchild Semiconductor, which produced the world's first commercial integrated circuit. In 1968, with the late Dr. Robert Noyce, he cofounded Intel. He was chief executive from 1979 until 1987, and was chairman of the board from 1979 until 1997. EDUCATION: Ph.D in chemistry and physics, California Institute of Technology., 1954; B.S. in chemistry, University of California-Berkeley, 1950. AGE: Born January 3, 1929 3. Andrew S. Grove CEO, 1987-1998 CAREER: Grove originally worked at Fairchild Semiconductor and joined Intel in 1968, creating the company's chip manufacturing operation. He was named chief operating officer in 1976 and president in 1979. He became chief executive in 1987 and was chairman of the board from 1997 to 2005. EDUCATION: Ph.D., University of California-Berkeley, 1963; B.A. in chemical engineering, City College of New York, 1960. AGE: Born September 2, 1936 4. Craig R. Barrett CEO, 1998-2005 CAREER: Joined Intel in 1974 and is credited with perfecting the manufacturing process for Intel's powerful microprocessors. He served as chief operating officer from 1993 to 1997, president from 1997 to 1998; chief executive from 1998 through 2005; and chairman from 2005 until 2009. EDUCATION: Ph.D. in materials science, Stanford University, 1964 AGE: Born August 29, 1939 5. Paul S. Otellini CEO, 2005-2013 CAREER: Otellini spent his career at Intel, joining the finance department in 1974 and holding a variety of management positions including chief operating officer and manager of several divisions. Otellini served as Intel's president and chief operating officer from 2002 to 2005 and was also elected to Intel's board of directors in 2002. He became CEO in May 2005.
EDUCATION: MBA, University of California-Berkeley, 1974; B.A. in economics, University of San Francisco, 1972 AGE: Born Oct. 12, 1950 6. Brian M. Krzanich CEO: Will become the chief executive officer on May 16. CAREER: Has been chief operating officer of Intel since January 2012. He previously held senior leadership positions in manufacturing with the company and began his career at Intel in 1982 as a process engineer. EDUCATION: B.A. in chemistry, San Jose State University, 1982 AGE: 52 B. PRODUCTS. At its founding, Intel was distinguished by its ability to make semiconductors. Its first product, in 1969, was the 3101 Schottky TTL bipolar 64-bit static random-access memory (SRAM), which was nearly twice as fast as earlier Schottky diode implementations by Fairchild and the Electrotechnical Laboratory in Tsukuba, Japan.In the same year Intel also produced the 3301 Schottky bipolar 1024-bit read-only memory (ROM) and the first commercial metal–oxide– semiconductor field-effect transistor (MOSFET) silicon gate SRAM chip, the 256-bit 1101. Intel's business grew during the 1970s as it expanded and improved its manufacturing processes and produced a wider range of products, still dominated by various memory devices. While Intel created the first commercially available microprocessor (Intel 4004) in 1971 and one of the first microcomputers in 1972, by the early 1980s its business was dominated by dynamic random-access memory chips. However, increased competition from Japanese semiconductor manufacturers had, by 1983, dramatically reduced the profitability of this market, and the sudden success of the IBM personal computer convinced then-CEO Andrew Grove to shift the company's focus to microprocessors, and to change fundamental aspects of that business model. By the end of the 1980s this decision had proven successful. Buoyed by its fortuitous position as microprocessor supplier to IBM and IBM's competitors within the rapidly growing personal computer market, Intel embarked on a 10-year period of unprecedented growth as the primary (and most profitable) hardware supplier to the PC industry. By launching its Intel Inside marketing campaign in 1989, Intel was able to associate brand loyalty with consumer selection, so that by the end of the 1990s, its line of Pentium processors had become a household name. TIMELINE:
6. ORGANIZATION STRUCTURE
7.
UPGRADATION STRATEGY
Sand 1. With about 25% (mass) Silicon is –after Oxygen –the second most frequent chemical element in the earth’s crust. 2. Sand –especially Quartz -has high percentages of Silicon in the form of Silicon dioxide (SiO2) and is the base ingredient for semiconductor manufacturing. Melted Silicon – Scale: wafer level (~300mm/ 12 inch) 1. Silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called Electronic Grade Silicon. 2. Electronic Grade Silicon may only have one alien atom every one billion Silicon atoms. The resulting mono crystal is called Ingot. Mono-crystal Silicon Ingot – Scale: wafer level (~300mm/ 12 inch) 1. An ingot has been produced from Electronic Grade Silicon. 2. One ingot weights about 100 kilograms (=220 pounds) and has a Silicon purity of 99.9999%.
Ingot Slicing – Scale: wafer level (~300mm / 12 inch) 1. The Ingot is cut into individual silicon discs called wafers.
Wafer– Scale: wafer level (~300mm/ 12 inch)
1. The wafers are polished until they have flawless, mirror-smooth surfaces. 2. Intel buys those manufacturing ready wafers from third party companies. 3. Intel’s highly advanced 45nm High-K/Metal Gate process uses wafers with a diameter of 300 millimeter (~12 inches). 4. When Intel first began making chips, the company printed circuits on 2-inch (50mm) wafers. Now the company uses 300mm wafers, resulting in decreased costs per chip.
Applying Photo Resist – Scale: wafer level (~300mm / 12 inch) 1. The liquid (blue here) that’s poured onto the wafer while it spins is a photo resist finish similar as the one known from film photography. 2. The wafer spins during this step to allow very thin and even application of this photo resist layer. Exposure– Scale: wafer level (~300mm / 12 inch) 1. The photo resist finish is exposed to ultra violet (UV) light. The chemical reaction triggered by that process step is similar to what happens to film material in a film camera the moment you press the shutter button. The photo resist finish that’s exposed to UV light will become soluble. The exposure is done using masks that act like stencils in this process step. When used with UV light, masks create the various circuit patterns on each layer of the microprocessor. A lens (middle) reduces the mask’s image. 2. So what gets printed on the wafer is typically four times smaller linearly than the mask’s pattern. Exposure– Scale: transistor level (~50-200nm) 1. Although usually hundreds of microprocessors are built on a single wafer, this picture story will only focus on a small piece of a microprocessor from now on –on a transistor or parts thereof. 2. A transistor acts as a switch, controlling the flow of electrical current in a computer chip. Intel researchers have developed transistors so small that about 30 million of them could fit on the head of a pin.
Washing off of Photo Resist – Scale: transistor level (~50-200nm) 1. The gooey photo resist is completely dissolved by a solvent. 2. This reveals a pattern of photo resist made by the mask. Etching– Scale: transistor level (~50-200nm) 1. The photo resist is protecting material that should not be etched away. 2. Revealed material will be etched away with chemicals. Removing Photo Resist – Scale: transistor level (~50-200nm) 1. After the etching the photo resist is removed and the desired shape becomes visible.
Applying Photo Resist – Scale: transistor level (~50-200nm) 1. There’s photo resist (blue color) applied, exposed and exposed photo resist is being washed off before the next step. 2. The photo resist will protect material that should not get ions implanted. Ion Implantation – Scale: transistor level (~50-200nm) 1. Through a process called ion implantation (one form of a process called doping), the exposed areas of the silicon wafer are bombarded with various chemical impurities called Ions. 2. Ions are implanted in the silicon wafer to alter the way silicon in these areas conducts electricity. 3. Ions are shot onto the surface of the wafer at very high speed. An electrical field accelerates the ions to a speed of over 300,000 km/h (~185,000 mph) Removing Photo Resist – Scale: transistor level (~50-200nm) 1. After the ion implantation the photo resist will be removed and the material that should have been doped (green) has alien atoms implanted now (notice slight variations in color).
Ready Transistor – Scale: transistor level (~50-200nm) 1. This transistor is close to being finished. 2. Three holes have been etched into the insulation layer (magenta color) above the transistor. 3. These three holes will be filled with copper which will make up the connections to other transistors. Electroplating– Scale: transistor level (~50-200nm) 1. The wafers are put into a copper sulphate solution as this stage. 2. The copper ions are deposited onto the transistor thru a process called electroplating. 3. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode) which is represented by the wafer. After Electroplating – Scale: transistor level (~50-200nm) 1. On the wafer surface the copper ions settle as a thin layer of copper. The Tick-Tock Model Through the Years Intel’s ―tick-tock‖ model inspires confidence in the future of microprocessors and the devices that depend on them. Following this model, Intel commits to—and has successfully delivered—continued innovations in manufacturing process technology and processor microarchitecture in alternating ―tick‖ and ―tock‖ cycles. Architectures releases until now: 1. P6,Netburst(Tock). 2. Core(Tock). 3. Penryn(Tick). 4. Nehalem(Tock). 5. Westmere(Tick). 6. Sandy bridge(Tock). 7. IvyBridge(Tick). 8. Haswell(Tock). 9. Broadwell(Tick). 10. Skylake(Tock). 11. CannonLake(Tick). 12. Larrabee(Tock). 13. Bonnell(Tock). 14. Saltwell(Tick).
15. Silvermont(Tock). 16. Airmont(Tock).
8. MANAGEMENT STRATEGY The number and variety of devices connected to the Internet are growing, and computing is becoming an increasingly personal experience. End users value consistency across devices that connect seamlessly and effortlessly to the Internet and to each other. Intel helps to enable this experience by innovating around three pillars of computing: energy-efficient performance, connectivity, and security. To meet these objectives, we are using our core assets: our silicon and process technology, our architecture and platforms, our global presence, our strong rela tionships across the industry, and our brand recognition. 1. Grow the PC and data center business with new users and uses. 2. Extend Intel’s PC platform leadership and develop exciting innovations to deliver new user experiences; and lead the transformation to open data centers and cloud computing. 3. Extend Intel solutions into adjacent markets. Transform the embedded industry with Intel® architecture (IA) in new market segments; and launch and ramp IA solutions in smartphones, tablets, smart TVs, and vehicles. 4. Create a continuum of personal computing. Expand IA differentiation with new capabilities across devices; excite leading software developers to create the best user experiences and applications on IA; and deliver new usage models with multi-communications connectivity. 5. Intel as an organization is extremely aware that the demand for its own main product, the microprocessor, is crucially dependent upon the continuous supply of complementary products by other firms. 6. Intel’s philosophy is that achieving platform leadership requires that a firm continuously innovate through internal processes on its own core product and successfully encourage complementors not only to supply but to keep innovating on complementary products. 7. The analysis of the data suggests that the strategic goal of Intel is to obtain consensus in the industry while maintaining some degree of directional control over interfaces,
affecting a large number of third-parties’ design decisions. 8. Intel is able to maintain an increasing supply of quality complementary products, even as the Intel microprocessor evolves, by a careful balancing act of competition and cooperation with third-parties. 9. In an industrial setting where the definition of roles is ambiguous, there is plenty of room for strategic choices. For example, intellectual property choices in interface design (e.g., deciding whether the product’s interface specification is ―proprietary‖ or ―open‖ to thirdparties) radically affects the incentives and costs for potential complementors to innovate on complementary products, and can induce either more competition — or a greater supply of complements. 10. Intel makes several kinds of interrelated decisions to achieve platform leadership: design decisions (where to put the interface — i.e., the boundary of the product); intellectual property decisions (whether the specification of this interface will be open or closed); pricing decisions (how much Intel will charge for royalties, if any, on ―half-products‖ such as APIs or SDKs); and mode of behavior decisions (i.e., acting towards another firm as a competitor or a complementor). 11. Intel has also set in place specific processes by which it initiates the design of interface standards and then rallies the consensus of other firms. 12. Intel often invests heavily up front in designing internal interfaces on which, later, it frequently chooses not to make any profit. Relinquishing royalty rights on the specifications and carefully integrating the technical input early and gradually in the process facilitates the endorsement of key players. 13. Intel also maintains loyalty from third-parties by signaling the low likelihood of Intel’s behaving against them opportunistically in the short term. Where complementors have a choice, Intel aims to nurture their incentives to innovate on products that are complementary to Intel, and not rival, products. Intel seems to enjoy high returns for building and sustaining its reputation as a firm that does not impulsively or carelessly step out of its product boundaries into the territory of its complementors. The informal, longterm relationships that are developed between Intel and third-parties provide a setting that fosters innovation and protects both from each other’s opportunism. 9. UPCOMING PROJECTS a. Broadwell Architecture: Broadwell is Intel's codename for the second processor in its Haswell microarchitecture. In keeping with Intel's tick-tock principle, Broadwell is the next step in semiconductor fabrication, with feature size reduced to 14 nanometers. Broadwell will adopt the Multi-Chip Package (MCP) design. New layout might be also moving the integrated voltage regulator (iVR) off-die and back onto the motherboards, in an attempt to reduce CPU's heat production. b. Skylake Architecture: Skylake is the codename for a processor micro architecture to be developed by Intel as the successor to the Hasswell architecture.Skylake will use a 14 nm process. There are no official details regarding this microarchitecture's development. The first Skylake processors are expected in 2015-2016.
10. INTEL’S RELATION TO MATERIAL REQUIREMENT PLANNING Material Replenishment Method. 1. This MRP driven procurement method is used with select direct materials suppliers across Intel's Systems Manufacturing and Assembly/Test sites. 2. This forecast is communicated with suppliers via RosettaNet XML PIP 4A3 and/or the Web Forecast application's Delivery Schedule Report. 3. Suppliers are required to ship a specific quantity of a material to an Intel site by a specified date. Material Requirements Planning. 1. MRP is a set of techniques using inventory position, bill of material (BOM) information, and the master production schedule (MPS) to calculate time-phased material requirements. 2. MRP data is pulled into the ARM replenishment system, enabling ARM to create replenishment forecasts for Suppliers. Partner Interface Process. 1. The RosettaNet model that depicts the activities, decisions and Partner Role interactions that fulfill an eBusiness transaction between two partners in a supply chain. 2. Each Partner must fulfill all obligations specified in a PIP. 3. If any one party fails to perform a service as specified in the approved RosettaNet PIP documentation then the business transaction is null and void. Web Forecast. 1. This is a component of the Web Suite application. 2. It includes forecast information from Outsourcing Enterprise Solutions Systems Manufacturing (OeS SM), Edge to Edge Capacity Exchange Planning (e2e CapX), and Materials Auto Replenishment (MAR). INTEL BUSINESS CONTINUITY PRINCIPLES: Intel’s business continuity program is based upon five key principles:Assess, Prepare, Test, Improve, and Communicate. 1.Assess:Accomplished through a Risk and Impact Assessment process.Every Designated organization is required to annually review and update their Risk and Impact Assessments for core business functions. 2. Prepare: A process of creating a business continuity plan based on the findings from the Risk and Impact Assessment 3. Test: Exercising the business continuity plan through realistic drill scenarios. 4. Improve: The process of strengthening our plans based upon discoveries made During tests or real life events.
11. MARKET EVALUATIONS
12. AWARDS AND RECOGNITIONS: 1. Intel is ranked 68 on FORTUNE Magazine's 100 Best Companies to Work for List! 2. Most InDemand Employers among Software Engineers (LinkedIn*) 3. World’s Greenest Companies list (Newsweek*) 4. Greenest Companies in America list -Top ten! (Newsweek) 5. Top 100 Veteran-Friendly Companies (U.S. Veterans Magazine*) 6. World’s Most Attractive Employers 2013 (Universum) 7. Top 50 Employer - #5! (Workforce Diversity) 8. National Top 50 list (US EPA) 9. India’s Best Places to Work For - Intel India #2 10. World’s Most Ethical Companies 2013 11. Best Place to Work - Intel Israel ranked 2nd!
12. WORKING CONDITIONS
Income for a Software Engineer at Intel (Mid Thirties)
How Much House Can I Afford?
Annual Household Income Monthly Gross Income Monthly State Income Tax (4%) Monthly Federal Income Tax (25%) Monthly minimum debt Monthly car payment Monthly student loan payment Minimum monthly credit card debt payment Total monthly salary left after debt and taxes Down Payment Amount Maximum I can pay for PITI a month (34% of your gross monthly income) Monthly Property Taxes Homeowner's insurance premium Maximum Principal and Interest Payment Maximum Loan Amount Maximum Purchase Price I can afford $66,000.00 $5,500.00 $220.00 $1,375.00 $550.00 $400.00 $0.00 $150.00 $3,355.00 $250,000.00 $1,870.00 $407.29 $69.64 $1,393.07 $238,750.00 $488,750.00
% of monthly gross
% of monthly gross after taxes and debt
4.00% 25.00% 10.00% 7.27% 0.00% 2.73% 61.00%
34.00% 7.41% 1.27% 25.33%
55.74% 12.14% 2.08% 41.52%
Cash left each month after taxes, debt, and PITI paid
$1,485.00
27.00%
REFERENCES: 1. http://www.intel.in/content/www/in/en/company-overview/company-overview.html 2. http://www.intel.in/content/www/xa/en/corporate-responsibility/corporate-responsibility.html 3. http://www.intel.com/content/www/us/en/jobs/locations/india.html 4. http://www.intel.in/content/www/in/en/intel-innovation/innovations.html 5. http://beforeyoubuypc.intel.in/learn 6. http://www.theinquirer.net/inquirer/news/1031210/secret-intel-revealed 7. http://news.cnet.com/2009-1001-215854.html 8. http://news.bbc.co.uk/2/hi/special_report/1998/04/98/INTEL/215645.stm 9. http://www.google.com/hostednews/afp/article/ALeqM5iSCa-6QNqHQ7MfRAjCk2vPtCvzOQ 10. http://edition.cnn.com/2011/TECH/mobile/05/04/intel.event/index.html 11. http://semiaccurate.com/2011/08/18/intel-moves-transistors-from-2d-to-3d-and-more/ 12. http://www.statista.com/statistics/263264/top-companies-in-the-world-by-market-value/ 13. http://www.intel.in/content/www/in/en/company-overview/intelmuseum.html?wapkw=intel+museum 14. http://www.intel.in/content/www/in/en/corporate-responsibility/corporate-responsibility-2007report.html 15. http://www.nytimes.com/2013/04/17/technology/intel-profits-fall-as-pc-slump-cuts-demand-forchips.html?_r=1 16. http://www.undeadly.org/cgi?action=article&sid=20060930232710&mode=expanded 17. http://media.corporateIr.net/media_files/irol/10/101302/2007annualReport/common/pdfs/intel_2007ar.pdf 18. http://www.google.com/finance?q=NASDAQ%3AINTC&fstype=ii&ei=bNL4ULj_B4rCkgXZe A 19. http://www.appliancedesign.com/eid/INTEL 20. http://news.cnet.com/8301-13924_3-20075602-64/intel-maps-out-tablet-plans-through2014/?part=rss&subj=news&tag=2547-1_3-0-20 21. In.reuters.com/intel 22. en.wikipedia.org wiki List of Intel microprocessors 23. http://www.intc.com/pricelist.cfm 24. http://www.intc.com/financials.cfm
